Chemical additives for improved copper chemical vapour deposition processing

Author: Norman J.A.T.   Roberts D.A.   Hochberg A.K.   Smith P.   Petersen G.A.   Parmeter J.E.   Apblett C.A.   Omstead T.R.  

Publisher: Elsevier

ISSN: 0040-6090

Source: Thin Solid Films, Vol.262, Iss.1, 1995-06, pp. : 46-51

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract