Author: Lin C.-F. Tseng W.-T. Feng M.-S. Wang Y.-L.
Publisher: Elsevier
ISSN: 0040-6090
Source: Thin Solid Films, Vol.347, Iss.1, 1999-06, pp. : 248-252
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Effect of glycine and hydrogen peroxide on chemical-mechanical planarization of copper
By Seal S. Kuiry S.C. Heinmen B.
Thin Solid Films, Vol. 423, Iss. 2, 2003-01 ,pp. :
Chemical-mechanical polishing for giant magnetoresistance device integration
By Hu Y.Z. Gutmann R.J. Chow T.P. Witcraft B.
Thin Solid Films, Vol. 332, Iss. 1, 1998-11 ,pp. :