Author: Fave A. Berger S. Beaumont A. Semmache B. Kleimann P. Linnroos J. Laugier A.
Publisher: Elsevier
ISSN: 0040-6090
Source: Thin Solid Films, Vol.383, Iss.1, 2001-02, pp. : 209-211
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Advanced excimer-laser annealing process for quasi single-crystal silicon thin-film devices
Thin Solid Films, Vol. 337, Iss. 1, 1999-01 ,pp. :
Phase formation between codeposited Co-Ta thin film and single-crystal silicon substrates
By Briskin G. Pelleg J. Talianker M.
Thin Solid Films, Vol. 288, Iss. 1, 1996-11 ,pp. :
Thin Solid Films, Vol. 368, Iss. 1, 2000-06 ,pp. :
Thin film sputtered silicon for silicon wafer bonding applications
Vacuum, Vol. 70, Iss. 2, 2003-03 ,pp. :