Impact of post via-etch cleans on mechanical reliability of W-plug vias

Author: Obeng Y.S.   Kang S.H.   Huang J.S.   Oates A.S.   Lin X.   Obeng J.S.  

Publisher: Elsevier

ISSN: 0040-6090

Source: Thin Solid Films, Vol.391, Iss.1, 2001-07, pp. : 149-156

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Abstract