A new method for deposition of cubic Ta diffusion barrier for Cu metallization

Author： Yuan Z.L. Zhang D.H. Li C.Y. Prasad K. Tan C.M. Tang L.J.

Publisher： Elsevier

ISSN： 0040-6090

Source： Thin Solid Films, Vol.434, Iss.1, 2003-06, pp. : 126-129

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