Damage to Si substrates during SiO 2 etching: Opportunities of subsequent removal by optimized cleaning procedures

Author： Richter H.H. Wolff A. Blum K. Hoeppner K. Kruger D. Sorge R.

Publisher： Elsevier

ISSN： 0042-207X

Source： Vacuum, Vol.47, Iss.5, 1996-05, pp. : 437-443

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