Editorial to special issue on design, test, integration and packaging of MEMS/MOEMS, 2007

ISSN： 0946-7076

Source： Microsystem Technologies, Vol.14, Iss.7, 2008-07, pp. : 893-893

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Design, test, integration and packaging of MEMS/MOEMS, 2006

By Michel B. Courtois B.

Microsystem Technologies, Vol. 13, Iss. 11-12, 2007-07 ,pp. : 1449-1449

Springer Publishing Company

Access to resources Recommend Favorite

Design, test, integration and packaging of MEMS/MOEMS, 2005

By Courtois Bernard Michel Bernd

Microsystem Technologies, Vol. 12, Iss. 10-11, 2006-09 ,pp. : 891-891

Springer Publishing Company

Access to resources Recommend Favorite

Microsystem Technologies: Foreword to special issue on Design, Test, Integration and Packaging of MEMS/MOEMS, 2003

By Courtois Bernard Michel Bernd

Microsystem Technologies, Vol. 10, Iss. 5, 2004-08 ,pp. : 345-345

Springer Publishing Company

Access to resources Recommend Favorite

Special Issue of the Conference Smart Sensors, Actuators and MEMS, Maspalomas, Gran Canaria, Spain, 2–4 May 2007

By Michel B. Becker T. Schmid U.

Microsystem Technologies, Vol. 14, Iss. 4-5, 2008-04 ,pp. : 439-439

Springer Publishing Company

Access to resources Recommend Favorite

Special issue on Cyberworlds'2007

By Magnenat-Thalmann Nadia

The Visual Computer, Vol. 24, Iss. 10, 2008-10 ,pp. : 857-857

Springer Publishing Company

Access to resources Recommend Favorite