Fluidic aligned, dense SWNTs arrays as potential die adhesive and thermal interface material

Author： Rong Hao   Wang Baoming   Lin Wei-Qing   Sun Lichao   Zheng Jin-Cheng   Lu Miao  

Publisher： Emerald Group Publishing Ltd

ISSN： 0954-0911

Source： Soldering & Surface Mount Technology, Vol.25, Iss.1, 2013-02, pp. : 45-50

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

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