Study of Substrate Preheating on Flattening Behavior of Thermal-Sprayed Copper Particles
Author： Yang K.
Publisher： Springer Publishing Company
ISSN： 1059-9630
Source： Journal of Thermal Spray Technology, Vol.19, Iss.6, 2010-12, pp. : 1195-1205
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Access to resources
Recommend
