Microstructural Evolution and Bonding Behavior during Transient Liquid-Phase Bonding of a Duplex Stainless Steel using two Different Ni-B-Based Filler Materials

Author： Yuan Xinjian

Publisher： Springer Publishing Company

ISSN： 1543-1940

Source： Metallurgical and Materials Transactions A, Vol.42, Iss.5, 2011-05, pp. : 1310-1324

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