Thermal stress intensity factors for partially insulated interface crack under uniform heat flow

Author: Lee K.Y.   Park S.-J.  

Publisher: Elsevier

ISSN: 0013-7944

Source: Engineering Fracture Mechanics, Vol.50, Iss.4, 1995-03, pp. : 475-482

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract