Analytical study on a new bond test method for measuring adhesion

Author: Cheng Y.-S.   Douglas W.H.   Versluis A.   Tantbirojn D.  

Publisher: Elsevier

ISSN: 0013-7944

Source: Engineering Fracture Mechanics, Vol.64, Iss.1, 1999-09, pp. : 117-123

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Abstract