Thermal stabilities and mechanical properties of epoxy molding compounds (EMC) containing encapsulated red phosphorous

Author: Kim J.   Yoo S.   Bae J.-Y.   Yun H.-C.   Hwang J.   Kong B.-S.  

Publisher: Elsevier

ISSN: 0141-3910

Source: Polymer Degradation and Stability, Vol.81, Iss.2, 2003-01, pp. : 207-213

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content