Thermal-mechanical interface crack behaviour of a surface mount solder joint - IEEE Transs

Author： Wu C.M.L.   Lai J.K.L.   Wu Y.-l.  

Publisher： Elsevier

ISSN： 0168-874X

Source： Finite Elements in Analysis and Design, Vol.30, Iss.1, 1998-07, pp. : 19-30

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