

Author: Kumar E Senthil Anderson I.P. Deng Z. Mohammadbeigi F. Wintschel T. Huang D. Watkins S.P.
Publisher: IOP Publishing
ISSN: 0268-1242
Source: Semiconductor Science and Technology, Vol.28, Iss.4, 2013-04, pp. : 45014-45020
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content






By Gurskii A. Hamadeh H. Körfer H. Yablonskii G. Zelenkovskii V. Bezjazychnaja T. Heuken M. Heime K.
Journal of Electronic Materials, Vol. 29, Iss. 4, 2000-04 ,pp. :


By Zhang X. Kalisetty S. Robinson J. Zhao G. Parent D. Ayers J. Jain F.
Journal of Electronic Materials, Vol. 26, Iss. 6, 1997-06 ,pp. :