Wafer bonding of 75 mm diameter GaP to AlGaInP-GaP light-emitting diode wafers

Author: Tan I.   Vanderwater D.   Huang J.   Hofler G.   Kish F.   Chen E.   Ostentowski T.  

Publisher: Springer Publishing Company

ISSN: 1543-186X

Source: Journal of Electronic Materials, Vol.29, Iss.2, 2000-02, pp. : 188-194

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Abstract