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Activation energies of intermetallic growth of Sn-Ag eutectic solder on copper substrates

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Influence of Dopant on Growth of Intermetallic Layers in Sn-Ag-Cu Solder Joints

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Critical Current Density for Inhibiting (Cu,Ni) 6 Sn 5 Formation on the Ni Side of Cu/Solder/Ni Joints

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A review on effect of minor alloying elements on thermal cycling and drop impact reliability of low-Ag Sn-Ag-Cu solder joints

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