Multiscale modelling of solidification microstructures, including microsegregation and microporosity, in an Al-Si-Cu alloy

Author： Lee P.D. Chirazi A. Atwood R.C. Wang W.

Publisher： Elsevier

ISSN： 0921-5093

Source： Materials Science and Engineering: A, Vol.365, Iss.1, 2004-01, pp. : 57-65

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