Electrical and thermal properties of the interface at diffusion-bonded and soldered 304 stainless steel and copper bimetal

Author: Yilmaz O.   Celik H.  

Publisher: Elsevier

ISSN: 0924-0136

Source: Journal of Materials Processing Technology, Vol.141, Iss.1, 2003-10, pp. : 67-76

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Abstract