Endpoint detectable plating through femtosecond laser drilled glass wafers for electrical interconnections

Author： Abe T.   Li X.   Esashi M.  

Publisher： Elsevier

ISSN： 0924-4247

Source： Sensors and Actuators A: Physical, Vol.108, Iss.1, 2003-11, pp. : 234-238

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

High-Speed Dicing of SiC Wafers by Femtosecond Pulsed Laser

By  

Materials Science Forum, Vol. 2015, Iss. 821, 2015-07 ,pp. : 524-527

Trans Tech Publications

Access to resources Recommend Favorite

Control of femtosecond laser written waveguides in silica glass

By Nguyen N.T.   Saliminia A.   Chin S.L.   Vallée R.  

Applied Physics B, Vol. 85, Iss. 1, 2006-10 ,pp. : 145-148

Springer Publishing Company

Access to resources Recommend Favorite

Formation of Si structure in glass with a femtosecond laser

By Miura Kiyotaka  

Applied Physics A, Vol. 93, Iss. 1, 2008-10 ,pp. : 183-188

Springer Publishing Company

Access to resources Recommend Favorite

Fabrication of silver nanosheets on quartz glass substrates through electroless plating approach

By Yi Zao   Xu Xibin   Fang Qi   Wang Yuying   Li Xibo   Tan Xiulan   Luo Jiangshan   Jiang Xiaodong   Wu Weidong   Yi Yougen   Tang Yongjian  

Applied Physics A, Vol. 114, Iss. 2, 2014-02 ,pp. : 485-493

Springer Publishing Company

Access to resources Recommend Favorite

Direct joining of glass substrates by 1 kHz femtosecond laser pulses

By Watanabe W.   Onda S.   Tamaki T.   Itoh K.  

Applied Physics B, Vol. 87, Iss. 1, 2007-03 ,pp. : 85-89

Springer Publishing Company

Access to resources Recommend Favorite