Author： Zhou C. Shan L. Robert Hight J. Ng S.H. Danyluk S.
Publisher： Elsevier
ISSN： 0043-1648
Source： Wear, Vol.253, Iss.3, 2002-08, pp. : 430-437
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
A chemical mechanical polishing model incorporating both the chemical and mechanical effects
By Qin K. Moudgil B. Park C.-W.
Thin Solid Films, Vol. 446, Iss. 2, 2004-01 ,pp. :
Access to resources
Recommend
Wear phenomena in chemical mechanical polishing
By Liang H. Kaufman F. Sevilla R. Anjur S.
Wear, Vol. 211, Iss. 2, 1997-11 ,pp. :
Effect of electric field on chemical mechanical polishing of langasite
By Lim D.-S. Yoon I. Danyluk S.
Wear, Vol. 249, Iss. 5, 2001-06 ,pp. :
Multiscale material removal modeling of chemical mechanical polishing
By Seok J. Sukam C.P. Kim A.T. Tichy J.A. Cale T.S.
Wear, Vol. 254, Iss. 3, 2003-02 ,pp. :
Modification of the Preston equation for the chemical-mechanical polishing of copper
By Luo Q. Ramarajan S. Babu S.V.
Thin Solid Films, Vol. 335, Iss. 1, 1998-11 ,pp. :