Author： Seok J. Sukam C.P. Kim A.T. Tichy J.A. Cale T.S.
Publisher： Elsevier
ISSN： 0043-1648
Source： Wear, Vol.254, Iss.3, 2003-02, pp. : 307-320
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Material characteristics and chemical-mechanical polishing of aluminum alloy thin films
By Wang Y.L. Wu J. Liu C.W. Wang T.C. Dun J.
Thin Solid Films, Vol. 332, Iss. 1, 1998-11 ,pp. :
Access to resources
Recommend
Three-dimensional wafer scale hydrodynamic modeling for chemical mechanical polishing
By Cho C.-H. Park S.-S. Ahn Y.
Thin Solid Films, Vol. 389, Iss. 1, 2001-06 ,pp. :
Wear phenomena in chemical mechanical polishing
By Liang H. Kaufman F. Sevilla R. Anjur S.
Wear, Vol. 211, Iss. 2, 1997-11 ,pp. :