Pressure-Sensitive Adhesives Based on Nanostructured Latex Particles

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International Journal of Polymeric Materials, Vol. 55, Iss. 8, 2006-08 ,pp. : 595-604

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Effect of Inorganic Fillers in Paper on the Adhesion of Pressure-Sensitive Adhesives

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Journal of Adhesion Science and Technology, Vol. 25, Iss. 6-7, 2011-01 ,pp. : 581-596

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Thermally activated pressure-sensitive adhesives

By Dar Yadunandan L.   Yuan-Huffman Wendy   Shah Smita   Huang Donna   Xiao Allison  

Journal of Adhesion Science and Technology, Vol. 21, Iss. 16, 2007-11 ,pp. : 1645-1658

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Rheology and adhesive properties of filled PIB-based pressure-sensitive adhesives. I. Rheology and shear resistance

By Kostyuk Anna   Ignatenko Viktoria   Smirnova Nina   Brantseva Tatiana   Ilyin Sergey   Antonov Sergey  

Journal of Adhesion Science and Technology, Vol. 29, Iss. 17, 2015-09 ,pp. : 1831-1848

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Electrical Properties of Copper-Filled Electrically Conductive Adhesives and Pressure-Dependent Conduction Behavior of Copper Particles

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Journal of Adhesion Science and Technology, Vol. 22, Iss. 14, 2008-09 ,pp. : 1673-1697

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