Author: Narasimhan Arunn
Publisher: Taylor & Francis Ltd
ISSN: 1042-6914
Source: Materials and Manufacturing Processes, Vol.20, Iss.2, 2005-01, pp. : 273-286
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
The Influence of Wafer Cleaning Process on the Silicon Surface Roughness
Advanced Materials Research, Vol. 2015, Iss. 1109, 2015-07 ,pp. :
Comparison of Bond Strength of Silicon-Silica and Silicon-Pyrex in Wafer Bonding
Advanced Materials Research, Vol. 2014, Iss. 1082, 2015-02 ,pp. :