Author: Lin Senpuu Chu Hsin-Sen
Publisher: Taylor & Francis Ltd
ISSN: 1091-7640
Source: Microscale Thermophysical Engineering, Vol.4, Iss.4, 2000-10, pp. : 245-260
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
By Alilat Nacim Baïri Abderrahmane Laraqi Najib
Numerical Heat Transfer Part A: Applications, Vol. 46, Iss. 2, 2004-07 ,pp. :