NUMERICAL SIMULATION OF SOLUTE REDISTRIBUTION DURING TRANSIENT LIQUID PHASE BONDING PROCESS FOR AL-CU ALLOY

Author: Jen Tien-Chien   Jiao Yuning  

Publisher: Taylor & Francis Ltd

ISSN: 1521-0634

Source: Numerical Heat Transfer Part A: Applications, Vol.39, Iss.2, 2001-02, pp. : 123-138

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