NUMERICAL SIMULATION OF HEAT DISSIPATION FROM A PLASTIC BALL GRID ARRAY PACKAGE IN A THIN

Author: Peng Guoyi   Ishizuka Masaru  

Publisher: Taylor & Francis Ltd

ISSN: 1521-0634

Source: Numerical Heat Transfer Part A: Applications, Vol.45, Iss.1, 2004-01, pp. : 67-83

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Abstract