Estimation of the Transient Heat Transfer Rate at the Boundary of an Electronic Chip Packaging

Author: Chen Wen-Lih   Yang Yu-Ching  

Publisher: Taylor & Francis Ltd

ISSN: 1521-0634

Source: Numerical Heat Transfer Part A: Applications, Vol.54, Iss.10, 2008-01, pp. : 945-961

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract