Heat Transfer Prediction of Recycle Effect for Improved Device Performance in Cool-Thermal Discharge Systems

Author： Ho Chii-Dong   Huang Jun-Wei   Tu Jr-Wei  

Publisher： Taylor & Francis Ltd

ISSN： 1521-0634

Source： Numerical Heat Transfer Part A: Applications, Vol.54, Iss.7, 2008-01, pp. : 709-725

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