3D Study of Thermal Stresses in Lead-Free Surface Mount Devices

Author： Hegde Pradeep   Whalley David   Silberschmidt Vadim  

Publisher： Taylor & Francis Ltd

ISSN： 0149-5739

Source： Journal of Thermal Stresses, Vol.31, Iss.11, 2008-11, pp. : 1039-1055

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