Effects of coupling agent thickness on residual stress in polyimide/γ-APS/silicon wafer j oints

By Kong D.I.  

Journal of Adhesion Science and Technology, Vol. 13, Iss. 7, 1999-01 ,pp. : 805-818

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Adhesion improvement of epoxy resin/copper lead frame j oints by azole compounds

By Song S.M.  

Journal of Adhesion Science and Technology, Vol. 12, Iss. 5, 1998-01 ,pp. : 541-561

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Effects of environment and heat treatment on an oxygen plasma-treated polyimide surface and its adhesion to a chromium overcoat

By Katnani A.D.   Knoll A.   Mycek M.A.  

Journal of Adhesion Science and Technology, Vol. 3, Iss. 1, 1989-01 ,pp. : 441-453

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Surface reactivity of polyimide and its effect on adhesion to epoxy

By Hoontrakul Pat   Pearson R. A.  

Journal of Adhesion Science and Technology, Vol. 20, Iss. 16, 2006-12 ,pp. : 1905-1928

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Changes in the adhesion strength between copper thin films and polyimide substrates after heat treatment

By Iwamori Satoru   Miyashita Takehiro   Fukuda Shin   Nozaki Shouhei   Sudoh Kazufuyu   Fukuda Nobuhiro  

Journal of Adhesion Science and Technology, Vol. 11, Iss. 6, 1997-01 ,pp. : 783-795

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