Effect of a Ti interlayer on the bond strength and thermal stability of the Cu/benzocyclobutene-divinyl tetramethyldisiloxane interface

Author: Shieu F.S.   Shiao M.H.  

Publisher: Taylor & Francis Ltd

ISSN: 1568-5616

Source: Journal of Adhesion Science and Technology, Vol.12, Iss.1, 1998-01, pp. : 19-28

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