Cause and effect of void formation during vacuum bag curing of epoxy film adhesives

Author: Pearce P.J.   Arnott D.R.   Camilleri A.   Kindermann M.R.   Mathys G.I.   Wilson A.R.  

Publisher: Taylor & Francis Ltd

ISSN: 1568-5616

Source: Journal of Adhesion Science and Technology, Vol.12, Iss.6, 1998-01, pp. : 567-584

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Abstract