Thermal contact resistance and adhesion studies on thin copper films on alumina substrates

Author: Sakami D.   Lahmar A.   Scudeller Y.   Danes F.   Bardon J. P.  

Publisher: Taylor & Francis Ltd

ISSN: 1568-5616

Source: Journal of Adhesion Science and Technology, Vol.15, Iss.12, 2001-11, pp. : 1403-1416

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Abstract