On the mechanism of popcorn blistering in copper clad laminates

Author： Seol Kyeong-Won   Choi Chang-Hee   Kim Sangyum   Son Seong Ho   Lee Jong K.  

Publisher： Taylor & Francis Ltd

ISSN： 1568-5616

Source： Journal of Adhesion Science and Technology, Vol.17, Iss.10, 2003-10, pp. : 1331-1349

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