Development of a high curing latency no-flow underfill with self-fluxing ability for lead-free solder interconnects

Author: Sun Yangyang   Zhang Zhuqing   Wong C. P.  

Publisher: Taylor & Francis Ltd

ISSN: 1568-5616

Source: Journal of Adhesion Science and Technology, Vol.18, Iss.1, 2004-01, pp. : 109-121

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Abstract