The interrelationships between electronically conductive adhesive formulations, substrate and filler surface properties, and joint performance. Part II: the effects of bonding pressure

Author: Gomatam Rajesh R.   Sancaktar Erol  

Publisher: Taylor & Francis Ltd

ISSN: 1568-5616

Source: Journal of Adhesion Science and Technology, Vol.18, Iss.11, 2004-10, pp. : 1245-1261

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content