Formulation and characterization of UV-light-curable electrically conductive pastes

Author: Cheng W. T.   Chih Y. W.   Lin C. W.  

Publisher: Taylor & Francis Ltd

ISSN: 1568-5616

Source: Journal of Adhesion Science and Technology, Vol.19, Iss.7, 2005-06, pp. : 511-523

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract