Improvements of the peel test for adhesion evaluation of thin metallic films on polymeric substrates

By Hagemeyer A.  

Journal of Adhesion Science and Technology, Vol. 8, Iss. 1, 1994-01 ,pp. : 29-40

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Thermal contact resistance and adhesion studies on thin copper films on alumina substrates

By Sakami D.   Lahmar A.   Scudeller Y.   Danes F.   Bardon J. P.  

Journal of Adhesion Science and Technology, Vol. 15, Iss. 12, 2001-11 ,pp. : 1403-1416

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Changes in the adhesion strength between copper thin films and polyimide substrates after heat treatment

By Iwamori Satoru   Miyashita Takehiro   Fukuda Shin   Nozaki Shouhei   Sudoh Kazufuyu   Fukuda Nobuhiro  

Journal of Adhesion Science and Technology, Vol. 11, Iss. 6, 1997-01 ,pp. : 783-795

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Stresses and adhesion of thin metallic coatings on oxide substrates

By Gillet M.   Mikaelian G.   Assaban A.   Gillet E.  

Journal of Adhesion Science and Technology, Vol. 19, Iss. 9, 2005-08 ,pp. : 753-763

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Application of FFT-Based Signal Analysis to Micro-Scratch Testing for Adhesion Strength Measurement of Thin Films and Measured Results Based on Different Measurement Parameters

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Journal of Adhesion Science and Technology, Vol. 23, Iss. 16, 2009-11 ,pp. : 1973-1991

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