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By Kim Y.-H.   Walker G.F.   Kim J.   Park J.  

Journal of Adhesion Science and Technology, Vol. 1, Iss. 1, 1987-01 ,pp. : 331-339

Taylor & Francis Ltd

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Local spin density investigation of the chromium / polyimide interface

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Investigation of the locus and mechanism of adhesion failure during peel tests on copper-chromium coated polyimide systems

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Journal of Adhesion Science and Technology, Vol. 5, Iss. 5, 1991-01 ,pp. : 349-363

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Electrochemical impedance spectroscopic investigation of adhesion formation mechanism at an epoxy/aluminum interface

By Zhang Shu-Yong   Kong Yan   Li Hong-Juan   Zhang Xiu-Yun   Zhang Zuo-Shan  

Journal of Adhesion Science and Technology, Vol. 17, Iss. 5, 2003-05 ,pp. : 677-685

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New heat-resistant polytriazole adhesives: investigation of adhesion of polytriazole resins to metals

By E Yanpeng   Wan Liqiang   Huang Farong   Du Lei  

Journal of Adhesion Science and Technology, Vol. 27, Iss. 16, 2013-08 ,pp. : 1767-1777

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