Analysis of stresses in adhesive joints applicable to IC chips using symbolic manipulation and the numerical method

Author: Cheng Tung-Hua   Tseng Ching-Huan   Hung Ching-Hua  

Publisher: Taylor & Francis Ltd

ISSN: 1568-5616

Source: Journal of Adhesion Science and Technology, Vol.20, Iss.15, 2006-11, pp. : 1669-1692

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Abstract