Investigation of moisture diffusion in electronic packages by molecular dynamics simulation

Author: Fan Hai Bo   Chan Edward K. L.   Wong Cell K. Y.   Yuen Matthew M. F.  

Publisher: Taylor & Francis Ltd

ISSN: 1568-5616

Source: Journal of Adhesion Science and Technology, Vol.20, Iss.16, 2006-12, pp. : 1937-1947

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Abstract