Strength improvement of a smart adhesive bonded joint system by partially integrated piezoelectric patches

Author: Cheng Jinquan   Taheri Farid   Han Haipeng  

Publisher: Taylor & Francis Ltd

ISSN: 1568-5616

Source: Journal of Adhesion Science and Technology, Vol.20, Iss.6, 2006-05, pp. : 503-518

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Abstract