Thermal Residual Stresses in Adhesively Bonded In-plane Functionally Graded Clamped Plates Subjected to an Edge Heat Flux
Author： Apalak M. Kemal
Publisher： Taylor & Francis Ltd
ISSN： 1568-5616
Source： Journal of Adhesion Science and Technology, Vol.25, Iss.15, 2011-08, pp. : 1861-1908
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