Design of a Low-cost Wire Bond Tape Ball Grid Array Package*

By Schueller R D   Plepys A P  

Circuit World, Vol. 22, Iss. 3, 1996-03 ,pp. : 10-15

Emerald Group Publishing Ltd

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Effect of Chip Dimension and Substrate Thickness on the Solder Joint Reliability of Plastic Ball Grid Array Packages*

By Lee S.-W.   Lau** J.H.  

Circuit World, Vol. 23, Iss. 1, 1997-01 ,pp. : 16-19

Emerald Group Publishing Ltd

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No Clean Mass Reflow of Large Plastic Ball Grid Array Packages

By Lau J.   Miremadi J.   Gleason J.   Haven R.   Ottoboni S.   Mimura S.  

Circuit World, Vol. 20, Iss. 3, 1993-12 ,pp. : 15-22

Emerald Group Publishing Ltd

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A low-cost chip size package ‐ NuCSP

By Chou T.   Lau J.  

Circuit World, Vol. 24, Iss. 1, 1998-01 ,pp. : 34-38

Emerald Group Publishing Ltd

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Solder Joint Reliability of Large Plastic Ball Grid Array Assemblies Under Bending, Twisting, and Vibration Conditions

By Lau J   Gratalo K   Schneider E   Marcotte T   Baker T  

Circuit World, Vol. 22, Iss. 1, 1996-01 ,pp. : 27-32

Emerald Group Publishing Ltd

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