Experiences gained manufacturing high density interconnect (HDI) printed wiring boards (PWBs)

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Circuit World, Vol. 29, Iss. 1, 2003-01 ,pp. : 14-18

Emerald Group Publishing Ltd

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Can laser direct imaging (LDI) meet the needs of high density interconnect (HDI) mass-production and packaging manufacturers?

By Altmann Uwe  

Circuit World, Vol. 32, Iss. 4, 2006-12 ,pp. : 15-18

Emerald Group Publishing Ltd

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An innovative "ChemicalVia" process for the production of high density interconnect printed circuit boards

By Silva Vitor da   Oliveira Rui de   Watts David   van der Bij Erik  

Circuit World, Vol. 30, Iss. 4, 2004-04 ,pp. : 27-33

Emerald Group Publishing Ltd

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Development of an HDI photovia process for portable products

By Beuhler Allyson   Tungare Aroon   Savic John  

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