New halogen-free materials for PWB, HDI and advanced package substrate

Author： Murai Hikari   Takeda Yoshiyuki   Takano Nozomu   Ikeda Ken  

Publisher： Emerald Group Publishing Ltd

ISSN： 0305-6120

Source： Circuit World, Vol.27, Iss.2, 2001-01, pp. : 7-11

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Halogen-free materials with improved thermal and electrical properties

By Bedner David   He Michael  

Circuit World, Vol. 35, Iss. 3, 2009-08 ,pp. : 3-7

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Regulations and market trends in lead-free and halogen-free electronics

By Nie Lei   Pecht Michael   Ciocci Richard  

Circuit World, Vol. 33, Iss. 2, 2007-05 ,pp. : 4-9

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Environmental and economic implications of a shift to halogen-free printed wiring boards

By Bergendahl Carl Gunnar   Lichtenvort Kerstin   Johansson Glenn   Zackrisson Mats   Nyyssönen Jonna  

Circuit World, Vol. 31, Iss. 3, 2005-09 ,pp. : 26-31

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Halogen-free laminates: worldwide trends, driving forces and current status

By Boysère Jérôme De   Beard Adrian  

Circuit World, Vol. 32, Iss. 2, 2006-05 ,pp. : 8-11

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Sophisticated HDI flexible substrates for advanced applications

By Stampanoni M  

Circuit World, Vol. 29, Iss. 3, 2003-03 ,pp. : 14-17

Emerald Group Publishing Ltd

Access to resources Recommend Favorite