Development of a new, more efficient and environmentally friendly method of producing high density interconnects - the "PRIME" process

By Albin David   Rames Jean-Claude   Dietel Claudia   Lenfert Kai   Rossi Stephanie   Starkey David   Down Joel   Pineda Ricard   Sardon Juan Carlos   Goosey Martin   Graves John   Bains Narinder   Cristoph Frank   Smeets Frank   Gilen Willy  

Circuit World, Vol. 27, Iss. 2, 2001-01 ,pp. : 12-16

Emerald Group Publishing Ltd

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An introduction to laser direct imaging for high density interconnects

By Omer Udi  

Circuit World, Vol. 29, Iss. 1, 2003-01 ,pp. : 32-35

Emerald Group Publishing Ltd

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Thermal reliability of high density interconnects utilizing microvias and standard through-hole technologies

By Young Todd   Carano Mike   Polakovic Frank  

Circuit World, Vol. 26, Iss. 1, 2000-01 ,pp. : 22-26

Emerald Group Publishing Ltd

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A novel process for the manufacturing of advanced interconnects

By Mosses R   Brackenridge S  

Circuit World, Vol. 29, Iss. 3, 2003-03 ,pp. : 18-21

Emerald Group Publishing Ltd

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Specially developed glass fabrics for ultimate small diameter holes of high density board by build-up method

By Kimura Yasuyuki  

Circuit World, Vol. 27, Iss. 1, 2001-01 ,pp. : 13-19

Emerald Group Publishing Ltd

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