SAVIA, an advanced multi-layer parallel lamination technique for high density, high performance printed circuit boards

Author： Kim Taehoon Mok Jee-Soo Song Chang-Kyu Park Jun-Heyoung Kim Kyung-O Sun Ben Min Byung-Youl

ISSN： 0305-6120

Source： Circuit World, Vol.31, Iss.3, 2005-09, pp. : 17-20

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