High aspect ratio "multiple wire" microvias in flexible PCBs

By Lindeberg Mikael   Hjort Klas  

Circuit World, Vol. 35, Iss. 4, 2009-11 ,pp. : 18-21

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Selection and qualification of polymers for rigid and flexible interconnect applications

By Schuessler Florian   Feldmann Klaus   Bigl Thomas  

Circuit World, Vol. 33, Iss. 2, 2007-05 ,pp. : 36-42

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Sensitivity study on material properties for the fatigue life prediction of solder joints under cyclic thermal loading

By Lee Shi-Wei Ricky   Zhang Xiaowu  

Circuit World, Vol. 24, Iss. 3, 1998-03 ,pp. : 26-31

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

A flexible and comprehensive approach to the assessment of large-scale power system security under uncertainty

By Paul J.-P.   Bell K.R.W.  

International Journal of Electrical Power and Energy Systems, Vol. 26, Iss. 4, 2004-05 ,pp. : 265-272

Elsevier

Access to resources Recommend Favorite

Correlation of Chemical Microstructure with Solderability of PCBs

By Marshall J.L.   Miiller D.E.   Sees J.   Matteson S.E.   Weathers D.   Lichtenberg L.  

Circuit World, Vol. 18, Iss. 1, 1993-12 ,pp. : 17-21

Emerald Group Publishing Ltd

Access to resources Recommend Favorite